Daily Archives: 10/03/2021

Ensinger – Innovative LDS technology replaces silicon wafers

Ensinger: Lithography-free manufacture of sensors and microsystems The market for sensor applications is a big one: large numbers of microsystems are used in the IT and telecommunications sector, the automotive and aerospace industries, and mechanical and plant engineering. These electronic components are based on ‘wafers’ – thin slices of material, usually silicon, onto which thin […]

Read More

VDMA – Rethinking cycles: How to close the plastics gap

• Restrictions on the use of recycled materials should be put to the test • Call for use quotas for recyclates at EU level • Call for a ban on exports of plastic waste to countries with low environmental standards Frankfurt, 9 March 2021 – The sustainable use of plastics is one of the decisive […]

Read More